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Providing High-Quality Etching Chemicals for the Semiconductor Industry

Etching chemicals are essential in the fabrication process of microchips and electronic components, enabling precise removal of unnecessary material layers from semiconductor wafer surfaces. With stringent requirements for purity and precision in manufacturing, selecting a certified chemical supplier is crucial for product performance and quality.

Loc Thien proudly offers a range of etching chemicals and semiconductor chemicals with international certifications such as ISO 9001 and ISO 14001, ensuring maximum quality, safety, and stability for your production processes.

📞 Hotline: 0979 89 19 29 | 📩 Email: [email protected] |🌐 Website: hoachatlocthien.com

Common Etching Chemicals in the Semiconductor Industry

Chemical Name

 Chemical Formula

Applications
Hydrofluoric Acid (HF) HF Etches SiO₂ in oxide layers, wafer surface treatment in wet etching.
Buffered Oxide Etch (BOE) HF + NH₄F Adjusts SiO₂ etching rate precisely for uniform surface etching.
Plasma Gases (Cl₂, SF₆, CF₄) Cl₂, SF₆, CF₄ Supports dry etching for ultra-fine details in microchips.
Nitrogen Trifluoride (NF₃) NF₃ Cleans silicon nitride and silicon dioxide in plasma environments.
Sulfur Hexafluoride (SF₆) SF₆ Efficient silicon etching for MEMS and microelectronics.
Phosphoric Acid (H₃PO₄) H₃PO₄ Etches silicon nitride layers in DRAM and CMOS production.
Etching Chemicals in the semiconductor industry Process - Etching Chemicals in semiconductor manufacturing

Types of Etching Chemicals in the Semiconductor Industry

The etching process in semiconductor manufacturing is divided into two main methods: wet etching chemicals and dry etching chemicals. Each has distinct characteristics, applications, and advantages suited to specific stages of microchip and electronic component fabrication.

1. Wet Etching Chemicals

Features:

  • Uses liquid chemical solutions to dissolve and remove unwanted material from wafer surfaces.
  • Ideal for processes requiring uniform and rapid etching, especially on large surfaces.
  • Effective for processing materials like oxide (SiO₂), silicon nitride (Si₃N₄), and thin metal layers.

Examples & Applications:

  • Hydrofluoric Acid (HF):
    • Application: Etches SiO₂ (silicon dioxide) layers in semiconductor wafer fabrication.
    • Advantage: Rapid and efficient oxide dissolution.
    • Note: Highly corrosive—requires full safety equipment.
  • Buffered Oxide Etch (BOE):
    • Composition: Mixture of HF and Ammonium Fluoride (NH₄F).
    • Application: Provides controlled etching rates for oxide (SiO₂) removal without damaging wafers.
    • Advantage: Ensures smooth and uniform etched surfaces.
  • Phosphoric Acid (H₃PO₄):
    • Application: Etches silicon nitride (Si₃N₄) in DRAM and CMOS production.
    • Advantage: Safer etching control compared to stronger chemicals.

2. Dry Etching Chemicals

Features:

  • Uses plasma gases or ionized reactions in a vacuum to remove material with high precision.
  • Ideal for processes requiring nanometer-scale accuracy, such as microchip fabrication.
  • Capable of etching silicon, oxide, and nitride layers on wafers.

Examples & Applications:

  • Chlorine (Cl₂):
    • Application: Etches silicon and metal compounds in plasma environments.
    • Advantage: Creates ultra-fine details with high precision.
    • Note: Corrosive and toxic—requires strict handling protocols.
  • Sulfur Hexafluoride (SF₆):
    • Application: Etches silicon in MEMS and electronic sensors.
    • Advantage: High efficiency for silicon etching in micro-scale applications.
  • Carbon Tetrafluoride (CF₄):
    • Application: Etches oxide (SiO₂) and silicon nitride (Si₃N₄) in plasma.
    • Advantage: Stable performance for large-area dry etching.

Wet vs. Dry Etching Chemicals Comparison

Criteria Wet Etching Dry Etching
Method Uses liquid chemicals to dissolve material. Uses plasma or ions in a vacuum environment.
Precision Lower precision for fine details. High precision for nanometer-scale features.
Etching Speed Faster for large areas. Slower but more precise.
Applications Etches oxide (SiO₂), silicon nitride (Si₃N₄). Etches silicon and materials for MEMS.
Safety Requires caution with corrosive chemicals like HF. Controls toxic gases like Cl₂ and SF₆.

Detailed Chemical Information

  • Hydrofluoric Acid (HF)
    • Key Feature: Powerful etchant for rapid SiO₂ layer removal in wet etching.
    • Application: Used in wafer surface treatment, especially oxide removal.
    • Safety Note: Highly corrosive—requires full protective gear.
  • Buffered Oxide Etch (BOE)
    • Key Feature: HF and NH₄F blend for controlled, uniform etching rates.
    • Application: Etches oxide (SiO₂) layers without damaging wafers.
  • Plasma Gases (Cl₂, SF₆, CF₄)
    • Key Feature: Creates plasma for high-precision dry etching of ultra-fine details.
    • Application: Used in microelectronics fabrication requiring nanometer accuracy.
  • Nitrogen Trifluoride (NF₃)
    • Key Feature: Efficiently cleans silicon nitride and silicon dioxide while minimizing waste.
    • Application: Optimizes plasma system performance in production.
  • Sulfur Hexafluoride (SF₆)
    • Key Feature: Effective silicon etchant for MEMS and microelectronics.
    • Application: Used in high-precision semiconductor sensors and components.
  • Phosphoric Acid (H₃PO₄)
    • Key Feature: Controlled silicon nitride etching with high safety.
    • Application: Ideal for DRAM, CMOS, and complex semiconductor production.

Why Choose Loc Thien as Your Supplier

  1. International Quality: Products certified with:
    • ISO 9001: Quality management standard.
    • ISO 14001: Environmental management standard.
    • ZDHC: Compliant with safe chemical management and environmental protection.
  2. Diverse Product Range: Suitable for all semiconductor production stages.
  3. Technical Support: Experienced engineers provide optimization and safety consultation.
  4. Stable Supply: Warehouses across Ho Chi Minh City, Binh Duong Province, Dong Nai Province, Da Nang, Can Tho, Bac Giang, Bac Ninh, Hung Yen, and Thai Nguyen ensure prompt delivery and standardized storage.

In addition to Phosphoric Acid, Loc Thien supplies other etching chemicals like HF, BOE, SF₆, NF₃, and specialized products. We offer customized solutions with flexible policies and abundant stock.


Frequently Asked Questions (FAQ) About Semiconductor Etching Chemicals


1. What’s the difference between wet and dry etching chemicals?

  • Wet Etching: Uses liquid chemicals to remove material. Effective for large-area etching of oxide (SiO₂) and silicon nitride (Si₃N₄). Examples: HF and BOE.

  • Dry Etching: Uses plasma gases for nanometer-scale precision. Ideal for silicon etching in MEMS. Examples: SF₆ and Cl₂.


2. Which etching chemicals are commonly used in microchip fabrication?

Common chemicals include:


  • HF: Etches SiO₂ on wafer surfaces.

  • BOE: Provides controlled wet etching for smooth surfaces.

  • Plasma Gases (Cl₂, SF₆, CF₄): Enables ultra-fine dry etching.

  • H₃PO₄: Etches silicon nitride in DRAM and CMOS.


3. How to ensure safety when handling etching chemicals?

  • Wet Chemicals: Wear protective gear (goggles, gloves, lab coats) for HF and BOE.

  • Dry Chemicals: Use closed systems and ventilation for toxic gases like Cl₂ and SF₆.

  • Store chemicals in cool, dry areas away from flammables.


4. Why are ISO 9001 and ISO 14001 certifications important?

  • ISO 9001: Ensures chemical quality meets technical standards.

  • ISO 14001: Guarantees eco-friendly production and minimal pollution risk.


These certifications validate international quality and safety for semiconductor applications.

5. What solutions does Loc Thien offer for semiconductor businesses?

Loc Thien provides:


  • Diverse etching chemicals like HF, BOE, SF₆, NF₃, H₃PO₄ for all production stages.

  • International certifications (ISO 9001, ISO 14001, ZDHC).

  • Technical support: Process optimization and safety guidance.

  • Stable supply: Nationwide warehouses for fast delivery.


6. Where are Loc Thien’s etching chemicals applied?

Our chemicals are used in:


  • Microchip fabrication: Etching SiO₂, silicon nitride, and metal layers.

  • MEMS production: Creating ultra-precise microstructures.

  • DRAM/CMOS: Etching silicon nitride with H₃PO₄.

  • Reactor cleaning: NF₃ removes impurities in plasma systems.


Contact Us


📞 Hotline: 0979 89 19 29
📩 Email: [email protected]
🌐 Website: hoachatlocthien.com

Loc Thien – High-quality etching chemicals for the semiconductor industry’s most demanding requirements!