FeCl3 40% PCB Etching Grade | India — Precision PCB Etching | Loc Thien
FeCl3 40% PCB Etching Grade imported from India — 41.80% concentration, density 1.474, FeCl2 <0.10%, Cu 0.0008%. Purpose-built for precision PCB etching. COA batch 08/2026. Loc Thien supply. Call +84 979 891 929.
Ferric Chloride 40% PCB Etching Grade (FeCl3 Liquid 40%, CAS 7705-08-0) is an ultra-pure, high-performance etching chemical imported directly from premier manufacturers in India by Loc Thien Chemical. Specifically formulated for high-density Printed Circuit Board (PCB) manufacturing, microelectronics chemical milling, and copper lead-frame etching. Distributed via 5–30-ton dedicated corrosion-resistant tankers and 1,000L IBC totes across Vietnam with batch-specific COA and GHS-compliant SDS. Technical Hotline: 0979 891 929.
1. Technical Specifications (Electronic PCB Grade)
Unlike standard industrial grade FeCl3 used for municipal wastewater flocculation, our Indian PCB Etching Grade complies with strict IPC-4562 and electronic fabrication impurity thresholds:
| Quality Parameter | Specification Limit | Test Method |
|---|---|---|
| Chemical Formula | FeCl3 (MW 162.20 g/mol) | Stoichiometric |
| CAS Registry Number | 7705-08-0 | Chemical Abstracts |
| UN Number & Class | UN 2582, Class 8 (Corrosive), Packing Group III | IMDG Code |
| Ferric Chloride Assay (FeCl3) | ≥ 40.0% (w/w) (39.5% – 41.5%) | Redox Titration |
| Ferrous Chloride Residual (FeCl2) | ≤ 0.10% (w/w) (Max 0.15%) | Potentiometric Titration |
| Specific Gravity at 25°C | 1.420 – 1.450 g/cm³ | Hydrometer (ASTM D1298) |
| Free Acid (as HCl) | ≤ 1.0% (w/w) | Acid-Base Titration |
| Copper Impurity (Cu) | ≤ 10 ppm (Typical < 8 ppm) | ICP-OES / AAS |
| Arsenic Impurity (As) | ≤ 1 ppm (Typical < 0.2 ppm) | Hydride Generation AAS |
| Lead Impurity (Pb) | ≤ 5 ppm | ICP-MS |
| Insoluble Matter | ≤ 0.05% | Gravimetric Analysis |
2. Specialized Applications in Electronic Manufacturing
- Rigid & Flexible PCB Copper Etching: Delivers exceptional etch factor and sharp line resolution (down to < 50 µm trace widths) with minimal undercut. Ultra-low ferrous (Fe²⁺) levels maximize copper dissolution capacity per liter.
- Photochemical Machining (PCM): Precision etching of thin stainless steel, copper alloys, and Kovar lead frames for semiconductor IC packaging without thermal distortion or mechanical stress.
- Rotogravure Cylinder Engraving: Smooth, uniform surface bite for copper gravure printing cylinders utilized in high-speed packaging industries.
- Regeneration & Copper Recovery: Fully compatible with online chlorine / hydrogen peroxide oxidation regeneration systems, significantly reducing hazardous waste handling.
3. Packaging, Handling & Tanker Logistics
Delivered nationwide from 6 bonded and regional chemical hubs: 30kg Jerrycans, 1,000L composite IBC containers, and bulk 5–30-ton dedicated rubber-lined tankers equipped with specialized discharge pumps. Storage tanks must be constructed from vinyl ester FRP, PVDF, PTFE, or rubber-lined carbon steel. Never store in unlined steel, aluminum, or brass vessels.
4. Frequently Asked Questions (FAQ)
Q1: Why is low FeCl2 content critical for PCB fine-line etching?
A: A high concentration of Fe²⁺ severely retards the chemical reaction kinetics between Fe³⁺ and metallic copper (Cu⁰ + 2Fe³⁺ → Cu²⁺ + 2Fe²⁺), causing lateral over-etching (undercutting) and ragged trace geometries. Our Indian grade maintains FeCl2 < 0.10% to ensure predictable, consistent etch rates across entire production panels.
Q2: Does Loc Thien provide full heavy metal ICP test reports per batch?
A: Yes. Every shipment is accompanied by a manufacturer Certificate of Analysis (COA) specifying Cu, As, Pb, Cr, and free acid content, fully compliant with RoHS and REACH standards required by FDI electronics manufacturers.
Contact Loc Thien Chemical at 0979 891 929 or [email protected] for 24/7 technical consultation and ex-tank bulk quotations.
